VY Optics Photoelectric Technology Co., Ltd.

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    Saw Grade LT Wafer

    Typical Specifications of Saw Grade LT Wafer

    Cutting AngleDeg.X/Y/Z/Y36/Y42/Y48/X112 etc
    Diameter/sizemm

    3”/76.2

    4”/100

    Tol(±)mm

    0.25

     0.5
    Thicknessmm

    0.10mm or more

    0.18mm or more

    Primary reference flat

    mm

    22mm or customized

    32.5mm or customized

    LTV (5mmx5mm)µm

    < 2

    < 2

    TTV

    µm

    < 8

    < 10

    Bow

    µm

    ±20  

    ±25

    Warp

    µm

    ≤ 30

    ≤ 40

    PLTV%≥95%(5mm*5mm) 

    ≥95%(5mm*5mm)

    Orientation FlatAll available
    Surface TypeSingle Side Polished /Double Sides Polished
    Polished side Ranm≤1

    Back Side Criteria

    µm

     General is 0.2-0.5 or as customized

    Edge Rounding mmCompliant with SEMI M1.2 Standard/refer to IEC622276

     

     

    Basic materials characteristics of Saw Grade LT Wafer

    Crystal symmetryTrigonal, 3m
    Lattice constant, Aa = 5.154       c = 13.783
    Density, g/cm37.45
    Melting point , °C1650
    Curie point , °C605
    Mohs hardness6
    Thermal expansion coefficient, 10-6/ °Caa = 16   ac = 4
    Thermal conductivity , mW/cm °C46
    Dielectric Constant (@ 100 KHz)ea = 54    ec = 43
    Refractive indices @ 633 nmno = 2.175   ne = 2.180
    Pyroelectric Coefficient:-2.3 10-4 C/°C/m 2

     

    The possible applications

    1. LiTaO3 wafers are used in the manufacturing of substrates for RF type SAW devices, high frequency filters with a wide bandwidth.
     2. These next generation substrates are necessary for handling high volume graphics applications for wireless communications such as "Bluetooth".